Touch panel having improved visibility and method of manufacturing the same

ABSTRACT

A touch panel having improved visibility is provided. The touch panel includes a window part, at least one ultraviolet (UV) resin layer attached to a bottom surface of the window part, and a display part including a touch sensor film module attached to a bottom surface of the at least one UV resin layer such that the UV resin layer prevents refractions and reflections of light.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation application of prior application Ser.No. 14/634,172, filed on Feb. 27, 2015 which is based on and claimedpriority to application Ser. No. 13/763,115, filed on Feb. 8, 2013,which has issued as U.S. Pat. No. 9,949,397 on Apr. 17, 2018 and claimedthe benefit under 35 U.S.C. § 119(a) of a Korean patent applicationfiled on Feb. 23, 2012 in Korean Intellectual Property Office andassigned Serial No. 10-2012-0018264, and a Korean patent applicationfiled on Aug. 20, 2012 in the Korean Intellectual Property Office andassigned Serial No. 10-2012-0090487, the entire disclosures of each ofwhich are hereby incorporated by reference.

TECHNICAL FIELD

The present disclosure relates to an electronic device. Moreparticularly, the present disclosure relates to a portable electronicdevice.

BACKGROUND

In general, the visibility of portable communication devices hasimproved due to remarkable developments in multimedia and displaytechnologies. Accordingly, touch panels are increasingly employed inportable communication devices.

In the case of a general resistive touch sensor, since the touch panelcan provide location information only when two sensors contact eachother as a result of touch pressure, a film needs to be attached to awindow provided in a portable communication device. In contrast, acapacitive touch panel provides the location of a point where electriccharges are discharged during a touch.

A capacitive touch panel will be described in more detail as follows.

FIG. 1 is a view illustrating a configuration of a touch panel includinga window according to the related art

Referring to FIG. 1, the capacitive touch panel 1 includes a window part2 formed of reinforced glass, a polymer film layer 3 attached to abottom surface of the window part 2, a pattern ultraviolet (UV) resinlayer 4 applied to an lower portion of the polymer film layer 3, a touchsensor film module 5 attached to a bottom surface of the pattern UVresin layer 4, and a display part, e.g., a Liquid Crystal Display (LCD)6 attached to a bottom surface of the touch sensor film module 5.

The pattern UV resin layer 4 is applied to the polymer film layer 3 toform a pattern 7. The pattern 7 is formed in the applied pattern UVresin layer 4, and the pattern 7 is deposited 8 and printed 9. Bubbles 1c may be generated during deposition or printing. The polymer film layer3 is attached to the window part 2 by using, e.g., an Optically ClearAdhesive (OCA) (not illustrated).

In FIG. 1, the touch sensor film module 4 is attached to a bracket 6 aof the display part (e.g., LCD) 6 through a double-sided tape 1 a. Then,an air layer 1 b is provided between the touch sensor film module 4 andthe display part (e.g., LCD) 6 to protect the display part (e.g., LCD) 6from deflection of the window part 2.

The configuration of the touch panel is disclosed in Korean patentapplication Laid-Open No. 10-2011-002857 (issued on Jan. 10, 2011).

However, when light passes through different media, refractions andreflections generally occur in the touch panel due to differences in therefractivity of the different media.

Thus, in the capacitive touch panel according to the related art, lightsequentially passes through the media including the window part, the UVresin layer, the touch sensor film module, the air layer, and thedisplay part (e.g., LCD), and thus refractions and reflections of lightoccur whenever the media are changed, lowering the visibility of theproduct.

In addition to the above problems in the related art, if an existingtouch panel is dropped, the UV resin layer is apt to be cracked by ahard primer layer provided in the polymer film layer due to the impact.Also, in the related art, an impact to a side of the touch panel maytransfer to the touch panel.

Therefore, a need exists for a method and apparatus for adding anotherUV resin layer for minimizing refractions and reflections of light tothe existing resin layer. Additionally, a need exists for a soft primerlayer to prevent the UV resin layer from being cracked due to the impactof, e.g., the touch panel being dropped. A further need also exists fora space to be provided in order to avoid damage from an impact to a sidesurface of the touch panel.

The above information is presented as background information only toassist with an understanding of the present disclosure. No determinationhas been made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the present invention.

SUMMARY

Aspects of the present invention are to address at least theabove-mentioned problems and/or disadvantages and to provide at leastthe advantages described below. Accordingly, an aspect of the presentinvention is to provide a touch panel having improved visibility, thatis, in which a transmittance of a product is increased and a visibilityof a product is enhanced, by additionally configuring a secondultraviolet (UV) resin layer for preventing refractions and reflectionsof light in a first UV resin layer, and a method of manufacturing thesame.

In accordance with an aspect of the present invention, a touch panelhaving improved visibility is provided. The touch panel includes awindow part, at least one ultraviolet (UV) resin layer attached to abottom surface of the window part, and a display part including a touchsensor film module attached to a bottom surface of the at least one UVresin layer, wherein the UV resin layer prevents refractions andreflections of light.

In accordance with another aspect of the present invention, a touchpanel having improved visibility is provided. The touch panel includes awindow part including a polymer film layer, a first UV resin layerattached to a bottom surface of the polymer film layer, a second UVresin layer attached to a bottom surface of the first UV resin layer toprevent refractions and reflections of light, and a touch sensor filmmodule attached to a bottom surface of the second UV resin layer.

In accordance with another aspect of the present invention, a method ofmanufacturing a touch panel having improved visibility is provided. Themethod includes manufacturing a window part, attaching a polymer filmlayer to a bottom surface of the window part, attaching a first UV resinlayer to a bottom surface of the polymer film layer, attaching a secondUV resin layer for preventing refractions and reflections of light to abottom surface of the first UV resin layer, and attaching a display partincluding a touch sensor film module to a bottom surface of the secondUV resin layer.

In accordance with another aspect of the present invention, a touchpanel having improved visibility is provided. The touch panel includes awindow part including a polymer film layer, a first UV resin layerattached to a bottom surface of the polymer film layer, a second UVresin layer attached to a bottom surface of the first UV resin layer toprevent refractions and reflections of light, and a display partincluding a touch sensor film module attached to a bottom surface of thesecond UV resin layer, wherein the polymer film layer includes a bondinglayer, a film body layer formed on a bottom surface of the bondinglayer, and a soft primer layer formed on a bottom surface of the filmbody layer.

In accordance with another aspect of the present invention, a touchpanel having improved visibility is provided. The touch panel includes awindow part including a polymer film layer, a first UV resin layerattached to a bottom surface of the polymer film layer, a second UVresin layer attached to a bottom surface of the first UV resin layer toprevent refractions and reflections of light, and a display partincluding a touch sensor film module attached to a bottom surface of thesecond UV resin layer, wherein the polymer film layer and the first UVresin layer are formed to be smaller than the window part and a bracketformed in the display part.

In accordance with another aspect of the present invention, a method ofmanufacturing a touch panel having improved visibility is provided. Themethod includes manufacturing a window part, attaching a polymer filmlayer to a bottom surface of the window part, attaching a first UV resinlayer through a soft primer layer formed in the polymer film layer,attaching a second UV resin layer for preventing refractions andreflections of light to a bottom surface of the first UV resin layer,and attaching a display part including a touch sensor film module to abottom surface of the second UV resin layer.

Other aspects, advantages, and salient features of the invention willbecome apparent to those skilled in the art from the following detaileddescription, which, taken in conjunction with the annexed drawings,discloses exemplary embodiments of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of the presentinvention will be more apparent from the following description taken inconjunction with the accompanying drawings, in which:

FIG. 1 is a view illustrating a configuration of a touch panel includinga window according to the related art;

FIG. 2 is an exploded view illustrating a touch panel having improvedvisibility according to a first exemplary embodiment of the presentinvention;

FIG. 3 is a view illustrating a coupled state of the touch panel havingimproved visibility according to the first exemplary embodiment of thepresent invention;

FIG. 4 is an enlarged view illustrating the touch panel having improvedvisibility according to the first exemplary embodiment of the presentinvention;

FIG. 5 is a flowchart illustrating a method of manufacturing a touchpanel having improved visibility according to the first exemplaryembodiment of the present invention;

FIG. 6 is a view illustrating a coupled state of a touch panel havingimproved visibility according to a second exemplary embodiment of thepresent invention;

FIG. 7 is an enlarged view illustrating a polymer film layer of thetouch panel having improved visibility according to the second exemplaryembodiment of the present invention; and

FIG. 8 is a flowchart illustrating a method of manufacturing a touchpanel having improved visibility according to the second exemplaryembodiment of the present invention.

FIG. 9A is a front perspective view of an electronic device according tovarious embodiments of the present disclosure;

FIG. 9B is a rear perspective view of an electronic device according tovarious embodiments of the present disclosure;

FIG. 9C is multiple views viewed from various sides of an electronicdevice according to various embodiments of the present disclosure;

FIG. 10 is an exploded perspective view of an electronic deviceaccording to various embodiments of the present disclosure;

FIG. 11 is a partially sectional view illustrating a coupled state of anelectronic device including an opaque layer according to variousembodiments of the present disclosure;

FIG. 12 illustrates a lenticular pattern according to variousembodiments of the present disclosure;

FIG. 13A is an enlarged view illustrating a lenticular pattern shapeaccording to various embodiments of the present disclosure;

FIG. 13B is an enlarged view illustrating a lattice pattern shapeaccording to various embodiments of the present disclosure.

FIG. 14 illustrates a network environment including an electronic deviceaccording to an embodiment of the present disclosure.

FIG. 15 illustrates a block diagram of an electronic device according toan embodiment of the present disclosure.

FIG. 16 illustrates a block diagram of a programming module according toan embodiment of the present disclosure.

Throughout the drawings, it should be noted that like reference numbersare used to depict the same or similar elements, features, andstructures.

DETAILED DESCRIPTION

The following description with reference to the accompanying drawings isprovided to assist in a comprehensive understanding of exemplaryembodiments of the invention as defined by the claims and theirequivalents. It includes various specific details to assist in thatunderstanding but these are to be regarded as merely exemplary.Accordingly, those of ordinary skill in the art will recognize thatvarious changes and modifications of the embodiments described hereincan be made without departing from the scope and spirit of theinvention. In addition, descriptions of well-known functions andconstructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are notlimited to the bibliographical meanings, but, are merely used by theinventor to enable a clear and consistent understanding of theinvention. Accordingly, it should be apparent to those skilled in theart that the following description of exemplary embodiments of thepresent invention is provided for illustration purpose only and not forthe purpose of limiting the invention as defined by the appended claimsand their equivalents.

It is to be understood that the singular forms “a,” “an,” and “the”include plural referents unless the context clearly dictates otherwise.Thus, for example, reference to “a component surface” includes referenceto one or more of such surfaces.

FIG. 3 is a view illustrating a coupled state of the touch panel havingimproved visibility according to the first exemplary embodiment of thepresent invention. FIG. 4 is an enlarged view illustrating the touchpanel having improved visibility according to the first exemplaryembodiment of the present invention.

Referring to FIGS. 2 and 3, the touch panel 10 includes a window part 11including a polymer film layer 12, and a display part 15 including firstand second ultraviolet (UV) resin layers 13 and 14 and a touch sensorfilm module 16. The polymer film layer 12 is attached to a bottomsurface of the window part 11 so that the first UV resin layer 13 to bedescribed below may be attached to the polymer film layer 12. The UVresin layer 13 includes the second UV resin layer 14 to be describedbelow, and is attached to a bottom surface of the polymer film layer 12to transfer light. The second UV resin layer 14 receives light havingpassed through the first UV resin layer 13, and is attached to a bottomsurface of the first UV resin layer 13 to prevent refractions andreflections of the transferred light. The touch sensor film module 16and a bracket 15 a formed in the display part 15 are attached to thesecond UV resin layer 14 together.

Further referring to FIG. 2, a pattern may be formed in the first UVresin layer. The pattern 13 a may be one of a decoration pattern, athree-dimensional pattern formed with fine hair lines, and a moldingpattern. Here, the pattern 13 a may be a pattern other than thedecoration pattern, the three-dimensional pattern, and the moldingpattern (for example, a repeated pattern).

In addition, post-processes such as deposition 17 and printing 18 may beperformed on the pattern. In an exemplary implementation, the postprocesses may be used to realize a color and a metallic feeling.

In exemplary embodiments, the thickness of the polymer film layer 12 maybe between 0.05 mm and 0.15 mm. However, the thickness of the polymerfilm layer 12 may be less than 0.05 mm or more than 0.15 mm.

In exemplary embodiments, the material of the window part 11 may be oneof tempered glass and reinforced plastic. However, the material of thewindow part 11 may be a material other than tempered glass andreinforced plastic.

In exemplary embodiments, the material of the polymer film layer 12 maybe one of Polyethylene Terephthalate (PET), Poly Methyl Methacrylate(PMMA), and Poly Carbonate (PC). However, the material of the polymerfilm layer 12 may be a material other than the above-listed materials.

In exemplary embodiments, the display part 15 may be one of a LiquidCrystal Display (LCD), a Light Emitting Diode (LED), and an ActiveMatrix Organic Light Emitting Diode (AMOLED). However, the display partmay be a display part other than the above-listed display parts.

Further referring to FIG. 3, in describing the second UV resin layer 14in more detail, as illustrated in FIG. 3, the touch sensor film module16 and the bracket 15 a formed in the display part 15 may be attached tothe second UV resin layer 14 together.

Here, the second UV resin layer 14 may be in a liquid state.

FIG. 4 is an enlarged view illustrating the touch panel having improvedvisibility according to an exemplary embodiment of the presentinvention.

Referring to FIG. 4, the polymer film layer 12 is attached to a bottomsurface of the window part 11 by using an Optical Clean Adhesive (OCA)(not illustrated). The first UV resin layer 13 is formed on a bottomsurface of the polymer film layer 12, and a pattern is formed in thefirst UV resin layer 13. The pattern 13 a is a decoration pattern, andthe decoration pattern is a repeated design pattern including fine hairlines. Post-processes such as deposition 17 and printing 18 areperformed on the pattern 13 a to realize a color and a metallic feeling.In this state, the second UV resin layer 14 in a liquid state is formedon a bottom surface of the first UV resin layer 13.

The touch sensor film module 16 and the bracket of the display part 15are attached to the second UV resin together.

Further referring to FIG. 4, light is introduced into the window part11, and the introduced light passes through the polymer film layer 12.Then, light is refracted and reflected whenever the light passes throughthe window part 11 and the polymer film layer 12.

The light having passed through the polymer film layer 12 is introducedinto the first UV resin layer 13 and is refracted and reflected at thesame time.

The light having passed through the first UV resin layer 13 passes thesecond UV resin layer 14 of the same kind, which prevents refractionsand reflections.

That is, the light is refracted and reflected when passing through thefirst UV resin layer 13, and is introduced into the second UV resinlayer 14 as it is. The introduced light passes through the second UVresin layer 14 as it is, and not being refracted and reflected. Thesecond UV resin layer 14 passes the light without refracting andreflecting it, and the light is then transferred to the display part 15after passing through the touch sensor film module 16.

Since the light having passed the first UV resin layer 13 passes thesecond UV resin layer 14 as it is and not being refracted and reflected,screen visibility can be improved, and screen degradation of the displaypart 15 due to a reduction in the transmittance of light can beaddressed at the same time.

That is, by configuring the second UV resin layer 14 for additionallypreventing refractions and reflections of light in the first UV resinlayer 13, the visibility of a product can be enhanced, the clarity ofthe product can be enhanced, and the design of the product can becomemore appealing.

According to the related art, when a film-type touch sensor film moduleis attached to a bottom surface of a UV resin layer having a pattern, anattached space is formed between the pattern and the touch sensor filmmodule, and bubbles 1 c (see FIG. 1) are generated in the space.Accordingly, a defect rate of the product increases.

Thus, in order to address these disadvantages, by applying the second UVresin layer 14 in a liquid state to the first UV hardening resin layer13 having a pattern 13, a space formed by a pattern according to therelated art can be prevented and bubbles 1 c (see FIG. 1) generated inthe space are prevented. Thus, the defect rate of the product due to thebubbles generated can be reduced.

In addition, although the bracket of the display part 15 and the touchsensor film module 16 are attached to each other by using a double-sidedtape 1 a (see FIG. 1) to form an air layer in the related art, theattached area of the double-sided tape is so small that the display part15 and the touch sensor film module 16 can be easily separated from eachother.

Thus, in order to address the disadvantages, in the second UV resinlayer 14, the attached area may be made wider so that the touch sensorfilm module 16 and the display part 15 can be attached to each other soas to enhance an attaching force of the product.

Touch panel 10 (see FIG. 2), according to an exemplary embodiment of thepresent invention, is applicable to an electronic device (notillustrated). However, the present invention is not necessarily limitedto electronic devices and may be applied to various types of electronicdevices.

Examples of various types of electronic devices according to exemplaryembodiments of the present invention may include all informationcommunication devices and multimedia devices such as an MP3 player, aPortable Multimedia Player (PMP), a navigation system, a gaming device,a laptop computer, an advertising panel, a television (TV), a digitalbroadcasting player, a Personal Digital Assistant (PDA), and a smartphone, and application devices thereof, including all mobilecommunication terminals operated based on communication protocolscorresponding to various communication systems.

Hereinafter, a method of manufacturing the touch panel having improvedvisibility according to an exemplary embodiment of the present inventionwill be described in detail.

FIG. 5 is a view illustrating a method of manufacturing the touch panelhaving improved visibility according to an exemplary embodiment of thepresent invention.

Referring to FIG. 5, a method of manufacturing the touch panel 10 havingimproved visibility will be described. In step S1, the window part 11formed of tempered glass is manufactured.

In step S2, the polymer film layer 12 is attached to a bottom surface ofthe window part 11 manufactured in step S1 by using an Optical CleanAdhesive (OCA) (not illustrated).

In step S3, the first UV resin layer 13 is attached to a bottom surfaceof the polymer film layer 12 from step S2.

The decoration pattern 13 a is formed in the first UV resin layer 13,and the decoration pattern 13 a is processed through deposition 17 andprinting 18.

In step S4, the second UV resin layer 14 for preventing refractions andreflections of light is attached to a bottom surface of the first UVresin layer 13 from step S3.

In step S5, the display part 15 including the touch sensor film module16 is attached to a bottom surface of the second UV resin layer 14 fromstep S4.

The first UV resin layer 13 corresponds to a pattern UV resin layer forforming a pattern, and the second UV resin layer 14 corresponds to anattaching UV resin layer for attaching the touch sensor film module 16and the display part 15 together.

FIG. 6 is a view illustrating a coupled state of a touch panel havingimproved visibility according to a second exemplary embodiment of thepresent invention. FIG. 7 is an enlarged view illustrating a polymerfilm layer of the touch panel having improved visibility according tothe second exemplary embodiment of the present invention.

Referring to FIGS. 6 and 7, the touch panel 20 includes a window part 21including a polymer film layer 22, a display part 25 including first andsecond UV resin layers 23 and 24 and a touch sensor film module 26. Thepolymer film layer 22 is attached to a bottom surface of the window part21 so that the first UV resin layer 23 to be described below may beattached to the polymer film layer 22. The first UV resin layer 23includes the second UV resin layer 24 to be described below, and isattached to a bottom surface of the polymer film layer 22 to transferlight. The second UV resin layer 24 receives light having passed throughthe first UV resin layer 23, and is attached to a bottom surface of thefirst UV resin layer 23 to prevent refractions and reflections of thetransferred light. The touch sensor film module 26 is attached to abottom of the second UV resin layer 24.

In the touch panel 20, by additionally configuring the second UV resinlayer 24, refractions and reflections of light caused by use of thefirst UV resin layer 23, and lowering of the screen quality of thedisplay part 25 due to distortion of a surface of the first UV resinlayer 23 and scratches, can be prevented.

A pattern 27 may be formed in the first UV resin layer 23. A bracket 25a formed in the display part 25 is attached to a bottom surface of thepattern 27 by using a double-sided tape 28.

The pattern 27 may be any one of a decoration pattern, athree-dimensional pattern formed with hair lines, a molding pattern, ora lattice pattern. The pattern 27 may also be a pattern other than thedisclosed patterns (for example, a repeated pattern).

In addition, post-processes such as deposition 27 a and printing 27 bmay be performed on the pattern 27. In an exemplary implementation, thepost processes may be used to realize a color and a metallic feeling,wherein the pattern 27 may be realized on a bottom surface of thepolymer film layer 22 through a roller or stamp process.

In describing the polymer film layer 22 with reference to FIG. 7 in moredetail, the polymer film layer 22 may include a bonding layer 22 a, afilm body layer 22 b, and a soft primer layer 22 c. The bonding layer 22a is formed of an OCA, and the polymer 22 is attached to a bottomsurface of the window part 21 by using the optical clear adhesive. Thefilm body layer 22 b is formed on a bottom surface of the bonding layer22 a. The soft primer layer 22 c is formed on a bottom surface of thefilm body layer 22 b to increase a bonding force with the first UV resinlayer 23 and an impact-resistant property.

In exemplary embodiments, a thickness of the bonding layer 22 a may be25 μm to 50 μm. However, a thickness of the bonding layer 22 a may beless than 25 μm or more than 50 μm.

A material of the film body layer 22 b may be any one of PET, PMMA, andPC. However, the material of the polymer film layer 22 may also be amaterial other than the above-listed materials.

The primer layer 22 c may correspond to a single-layered or multilayeredprimer layer to increase a bonding force with the first UV resin layer23 and to add an impact-resistant property.

A hardness of the primer layer 22 c may be a pencil hardness of H to Bto prevent the first UV resin layer 23 from cracking when an electronicdevice is dropped.

The polymer film layer 22 may be bonded to the window part 21 through aroller or stamp process.

An upper surface of the window part 21 may correspond to a plane or ashape having a curvature. That is, an upper surface of the window part21 may be any one of 2.5 D and 3D shapes having a curvature.

The first and second UV resin layers 23 and 24 may be formed of anacrylate or polyurethane material. However, the first and second UVresin layers 23 and 24 may also be a material other than the disclosedmaterials. A hardness of the first and second resin layers 23 and 24 maybe a pencil hardness of F to B.

As illustrated in FIG. 6, the polymer film layer 22 and the first UVresin layer 23 may be formed to be smaller than the window part 21 andthe bracket 25 a formed in the display part 25.

That is, an avoidance space 30 for avoiding an impact F (see FIG. 7)transferred to a side of the electronic device if, for example, theelectronic device (not illustrated) is dropped, or for preventing anexternal coupling structure from being impacted when the couplingstructure is pushed in, is formed between the polymer film layer 22 andthe bracket 25 a.

In exemplary embodiments, a thickness of the avoidance space 30 may befrom 0 to 0.3 mm, or more specifically, a thickness of the avoidancespace 30 may be from only 0 mm to 0.25 mm.

In describing a process of manufacturing the touch panel 20 havingimproved visibility in more detail with reference to FIGS. 6 and 7, asillustrated in FIG. 6, the window part 21 is attached to the bondinglayer 22 a formed of an OCA (not illustrated) formed on an upper surfaceof the polymer film layer 22. The first UV resin layer 23 is attached byusing the soft primer layer 22 c formed on a bottom surface of thepolymer film layer 22. The pattern 27 is formed in the first UV resinlayer 23. The pattern may correspond to any of a pattern of a hair line,a lattice pattern, and the like. In this state, the second UV resinlayer 24 is attached to a bottom surface of the first UV resin layer 23.The touch sensor film module 26 is attached to the second UV resin layer24, and the bracket 25 a of the display part 25 is attached to thepattern 27 by using a double-sided tape 28.

Referring to FIG. 7, the polymer film layer 22 and the first UV resinlayer 23 are formed to be smaller than the window part 21 and thebracket 25 a of the display part 25, and thus the polymer film layer 22and the first UV resin layer 23 are formed between the window part 21and the bracket 25 a of the display part 25 are recessed by apredetermined depth to inner sides of the window part 21 and the bracket25 a of the display part 25 at the same time.

That is, the polymer film layer 22 and the first UV resin layer 23 arerecessed and the avoidance space 30 is formed between the window part 21and the bracket 25 a, and an impact F (see FIG. 7) transferred to sidesurfaces of the polymer film layer 20 and the first UV resin layer 23can be avoided by the avoidance space 30 when the touch panel 20 drops.

Referring to FIG. 7, when the touch panel 20 is dropped, the protrudingwindow part 21 and bracket 25 a are brought into contact so that animpact F is applied to the protruding window part 21 and bracket 25 aand the mitigated impact F is transferred to the polymer film layer 22and the first UV resin layer 23.

Further, if, for example, an external coupling structure (notillustrated) is pushed into the touch panel 20, the window part 21 andthe bracket 25 a first contact the external coupling structure so thatan impact is applied to the window part 21 and the bracket 25 a and themitigated impact is transferred to the polymer film layer 22 and thefirst UV resin layer 23.

Thus, the polymer film layer 22 and the first UV resin layer 23 arefirst directly brought into contact when the touch panel 20 is dropped,and an external coupling structure is pushed in to prevent an impact F(see FIG. 7) from being transferred. Accordingly, the polymer film layer22 and the first UV resin layer 23 can be protected.

Additionally, the primer layer (not illustrated) formed on an existingpolymer film layer 3 (see FIG. 1) may be formed of a hard material,causing the UV resin layer 4 (see FIG. 1) to easily crack when anelectronic device is dropped.

Thus, in order to address this disadvantage, in exemplary embodiments ofthe present invention, a soft primer layer may be formed in the polymerfilm layer 22 to improve a bonding force of the first UV resin layer 23and to prevent the first UV resin layer 23 from cracking due to animpact F (see FIG. 7) generated if, for example, an electronic device isdropped.

Hereinafter, a method of manufacturing the touch panel having improvedvisibility according to the second embodiment of the present inventionwill be described in detail.

FIG. 8 is a view illustrating the method of manufacturing a touch panelhaving improved visibility according to an exemplary embodiment of thepresent invention.

Referring to FIG. 8, the method of manufacturing the touch panel 20having improved visibility will be described. In step S1, the windowpart 21 formed of tempered glass is manufactured.

In step S2, the polymer film layer 22 is attached to a bottom surface ofthe window part 21 manufactured in step S1 by using the bonding layer 22a.

In step S3, the first UV resin layer 23 is attached to a bottom surfaceof the polymer film layer 22 by using the soft primer layer 22 c fromstep S2.

A pattern 27 such as a hair line, a lattice pattern, or the like may beformed in the first UV resin layer 23

In step S4, the second UV resin layer 24 for preventing refractions andreflections of light is attached to a bottom surface of the first UVresin layer 23 from step S3.

In step S5, the display part 25 including the touch sensor film module26 is attached to a bottom surface of the second UV resin layer 24 fromstep S4.

The polymer film layer 22 and the first UV resin layer 23 are formed tobe smaller than the window part 21 and the bracket 25 a formed in thedisplay part 25.

That is, an avoidance space 30 for avoiding an impact transferred to aside of the electronic device if, for example, the electronic device(not illustrated) is dropped, or for preventing an external couplingstructure from being impacted when the coupling structure (notillustrated) is pushed in, is formed between the polymer film layer 22and the bracket 25 a.

In exemplary embodiments of the present invention, a thickness of theavoidance space 30 may be from 0 to 0.3 mm, or more specifically, athickness of the avoidance space 30 may be from only 0 to 0.25 mm.

FIG. 9A is a front perspective view of an electronic device 200according to various embodiments of the present disclosure. FIG. 9B is arear perspective view of an electronic device according to variousembodiments of the present disclosure. FIG. 9C is multiple views viewedfrom various sides of an electronic device according to variousembodiments of the present disclosure.

Referring to FIGS. 9A to 9C, a display 201 may be installed on a frontsurface 2001 of an electronic device 200. A receiver 202 for receiving avoice of a counterpart may be disposed on an upper side of the display201. A microphone unit 203 for transmitting a voice of the user of theelectronic device to a counterpart may be disposed on a lower side ofthe display 201.

According to an embodiment of the present disclosure, a component forperforming various functions of the electronic device 200 may bedisposed around the receiver 202. The component may include at least onesensor module 204. The sensor module 204 may include, for example, atleast one of an illumination intensity sensor (for example, an opticalsensor), a proximity sensor (for example, an optical sensor), aninfrared ray sensor, and an ultrasonic sensor. According to anembodiment of the present disclosure, the components may include a frontcamera unit 205. According to an embodiment of the present disclosure,the components may include an indicator 206 for informing the user ofstate information of the electronic device 200.

According to various embodiments of the present disclosure, theelectronic device 200 may include a metallic bezel 220 as a metallichousing. According to an embodiment of the present disclosure, themetallic bezel 220 may be disposed along a periphery of the electronicdevice 200, and may be expanded to at least an area of a rear surface ofthe electronic device 200 extending from the periphery to be disposed.According to an embodiment of the present disclosure, the metallic bezel220 may define at least a portion of the thickness of the electronicdevice 200 along the periphery of the electronic device 200, and mayhave a closed loop shape. However, the present disclosure is not limitedthereto, and the metallic bezel 220 may be formed in a manner thatcontributes to at least a portion of the thickness of the electronicdevice 200. According to an embodiment of the present disclosure, themetallic bezel 220 may be disposed only in at least an area of theperiphery of the electronic device 200. According to an embodiment ofthe present disclosure, when the metallic bezel 220 contributes to aportion of the housing of the electronic device 200, the remainingportions of the housing may be replaced by a nonmetallic member. In thiscase, the housing may be formed in a manner in which a nonmetallicmember is insert injection-molded in the metallic bezel 220. Accordingto an embodiment of the present disclosure, the metallic bezel 220 mayinclude one or more articulation parts 225 and 226, and the unit bezelpart separated by the articulation parts 225 and 226 may be utilized asan antenna radiation body. According to an embodiment of the presentdisclosure, an upper bezel part 223 may contribute as a unit bezel partby a pair of articulation parts 225 formed at a predetermined interval.According to an embodiment of the present disclosure, a lower bezel part224 may contribute as a unit bezel part by a pair of articulation parts226 formed at a predetermined interval. According to an embodiment ofthe present disclosure, the articulation parts 225 and 226 may be formedtogether when the nonmetallic member is insert injection-molded in themetallic member.

According to various embodiments of the present disclosure, the metallicbezel 220 may have a closed loop shape along the periphery, and may bedisposed in a manner that contributes to the entire thickness of theelectronic device 200. According to an embodiment of the presentdisclosure, when the electronic device 200 is viewed from the frontside, the metallic bezel 220 may include a left bezel part 221, a rightbezel part 222, an upper bezel part 223, and a lower bezel part 224.

According to various embodiments of the present disclosure, variouselectronic components may be disposed in the lower bezel part 224 of theelectronic device. According to an embodiment of the present disclosure,a speaker unit 208 may be disposed on one side of the microphone unit203. According to an embodiment of the present disclosure, an interfaceconnector port 207 for receiving a data transmitting/receiving functionby an external device and external power to charge the electronic device200 may be disposed on an opposite side of the microphone unit 203.According to an embodiment of the present disclosure, an ear jack hole209 may be disposed on one side of the interface connector port 207.According to an embodiment of the present disclosure, all of themicrophone unit 203, the speaker unit 208, the interface connector port207, and the ear jack hole 209 may be disposed in an area of the unitbezel part formed by the pair of articulation parts 226 disposed in thelower bezel part 224. However, the present disclosure is not limitedthereto, and at least one of the above-mentioned electronic componentsmay be disposed in an area including the articulation part 226 or on anoutside of the unit bezel part.

According to various embodiments of the present disclosure, variouselectronic components also may be disposed in the upper bezel part 223of the electronic device 200. According to an embodiment of the presentdisclosure, a socket unit 216 for inserting a card type external devicemay be disposed in the upper bezel part 223. According to an embodimentof the present disclosure, the socket unit 216 may accommodate at leastone of a private ID card for the electronic device (for example, a SIMcard and a UIM card) and a memory card for expanding a storage space.According to an embodiment of the present disclosure, an infrared raysensor module 213 may be disposed on one side of the socket unit 216,and an auxiliary microphone unit 217 may be disposed on one side of theinfrared ray sensor module 213. According to an embodiment of thepresent disclosure, all of the socket unit 216, the infrared ray sensormodule 213, and the auxiliary microphone unit 217 may be disposed in anarea of the unit bezel part formed by the pair of articulation parts 225disposed in the upper bezel part 223. However, the present disclosure isnot limited thereto, but at least one of the above-mentioned electroniccomponents may be disposed in an area including the articulation part225 or on an outside of the articulation part.

According to various embodiments of the present disclosure, at least onefirst side key button 211 may be disposed in the left bezel part 221 ofthe metallic bezel 220. According an embodiment of the presentdisclosure, a pair of first side key buttons 211 may protrude from theleft bezel part 221 to contribute to a volume up/down function and ascroll function. According to an embodiment of the present disclosure,at least one second side key button 212 may be disposed in the rightbezel part 222 of the metallic bezel 220. According to an embodiment ofthe present disclosure, the second side key button 212 may contribute toa power on/off function and a wakeup/sleep function of the electronicdevice. According to an embodiment of the present disclosure, at leastone key button 210 may be disposed in at least an area of a lower areaof the front surface 2001 of the electronic device 200 other than thedisplay. According to an embodiment of the present disclosure, the keybutton 210 may perform a home key button function. According to anembodiment of the present disclosure, a fingerprint recognition sensorunit may be disposed on an upper surface of the home key button.According to an embodiment of the present disclosure, the home keybutton may perform a first function (a home screen return function or awakeup/sleep function) through a physical press operation, and mayperform a second function (for example, a fingerprint recognitionfunction) through a swiping of an upper surface of the home key button.Although not illustrated, touch pads are disposed on the left and rightsides of the key button 210 to perform a touch function.

According to various embodiment of the present disclosure, a rear cameraunit 213 may be disposed on a rear surface 2002 of the electronic device200, and at least one electronic component 214 may be disposed on oneside of the rear camera unit 213. According to an embodiment of thepresent disclosure, the electronic component 214 may include at leastone of an illumination intensity sensor (for example, an opticalsensor), a proximity sensor (for example, an optical sensor), aninfrared ray sensor, an ultrasonic sensor, a heart rate sensor, and aflash unit.

According to various embodiments of the present disclosure, a frontsurface 2001 including the display 201 may include a planar part 2011, aleft bending part 2012 and a right bending part 2013 formed on the leftand right sides of the planar part 2011. According to an embodiment ofthe present disclosure, the front surface 2001 of the electronic device200 may include all of a display area 201 and the other areas (forexample, a BM area) using one window. According to an embodiment of thepresent disclosure, the left and right bending parts 2012 and 2013 mayextend in the x-axis direction of the electronic device of FIG. 2A inthe planar part 2011. According to an embodiment of the presentdisclosure, the left and right bending parts 2012 and 2013 maycontribute as a part of the side surface of the electronic device 200.In this case, the left and right bending parts 2012 and 2013 and theleft and right bezel parts 221 and 222 of the metallic bezel 220 maycontribute as a side surface of the electronic device 200 together.However, the present disclosure is not limited thereto, and the frontsurface 2001 including the display 201 may include only at least one ofthe left and right bending parts 2012 and 2013. According to anembodiment of the present disclosure, the front surface 2001 may includeonly a left bending part 2012 along the planar part 2011, or may includeonly a right bending part 2013 along the planar part 2011.

According to various embodiments of the present disclosure, the frontsurface 2001 may include a window including the left and right bendingparts 2012 and 2013 and a flexible display module applied to at least anarea of a lower side of the window. According to an embodiment of thepresent disclosure, an area including the flexible display module maycontribute as the display area 201. According to an embodiment of thepresent disclosure, the window may be formed in a method in which anupper surface and a rear surface of the window are bent at the same time(hereinafter, a 3-D method). However, the present disclosure is notlimited thereto, but the left and right parts of the upper surface ofthe window may be curved and the rear surface of the window may beformed to be planar (hereinafter, a 2.5D method). According to anembodiment of the present disclosure, the window may be formed of atransparent glass material (for example, sapphire glass) or atransparent synthetic resin material.

According to various embodiments of the present disclosure, theelectronic device 200 may control the display module to selectivelydisplay information. According to an embodiment of the presentdisclosure, the electronic device 200 may control the display module toprovide a screen only in the planar part 2011. According to anembodiment of the present disclosure, the electronic device 200 maycontrol the display module to provide a screen in any one of the leftand right bending parts 2012 and 2013 together with the planar part2011. According to an embodiment of the present disclosure, theelectronic device 200 may control the display module to provide a screenin only one of the left and right bending parts 2012 and 2013 except forthe planar part 2011.

According to various embodiment of the present disclosure, the rearsurface 2002 of the electronic device 200 also may be formed by onewindow 215 as a whole. According to an embodiment of the presentdisclosure, a rear surface 2002 may include a planar part 2151substantially formed at the center thereof, a left bending part 2152 anda right bending part 2153 formed on the left and right sides of theplanar part 2151. According to an embodiment of the present disclosure,the window 215 may be configured in a 2.5D manner in which the left andright bending parts 2152 and 2153 of the outer surface of the window 215are curved and a rear surface of the window 215 is formed to be planar.However, the present disclosure is not limited thereto, but the windowmay be formed in a 3D manner as in the window disposed in the frontsurface 2001. According to an embodiment of the present disclosure, theleft and right bending parts 2152 and 2153 may contribute as a part ofthe side surface of the electronic device 200. In this case, the leftand right bending parts 2152 and 2153 and the left and right bezel parts221 and 222 of the metallic bezel 220 may contribute as a side surfaceof the electronic device 200 together. However, the present disclosureis not limited thereto, and the rear surface 2002 may include only atleast one of the left and right bending parts 2152 and 2153. Accordingto an embodiment of the present disclosure, the rear surface 2002 mayinclude only a left bending part 2152 along the planar part 2151, or mayinclude only a right bending part 2153 along the planar part 2151.

According to various embodiments of the present disclosure, upper leftand right corner parts and lower left and right corner parts of thefront surface 2001 may be simultaneously inclined in the x-axisdirection, the y-axis direction, and the z-axis direction of FIG. 2Awhile the window is bent. Due to the shape, the heights of the sidesurfaces of the upper left and right corner parts and the lower left andright corner parts of the metallic bezel 220 may gradually decrease.

FIG. 10 is an exploded perspective view of an electronic device 300according to various embodiments of the present disclosure. Hereinafter,the electronic device 300 of FIG. 10 and the above-mentioned electronicdevice 200 are the same electronic device.

Referring to FIG. 10, the electronic device 300 may be disposed suchthat a PCB 360, a bracket 320, a display module 330, and a front window340 are sequentially stacked on an upper side of the housing 310.According to an embodiment of the present disclosure, a wireless powertransmission/reception member 380 and a rear window 350 may besequentially stacked on a lower side of the housing 310. According to anembodiment of the present disclosure, the battery pack 370 may beaccommodated in an accommodation space 311 of the battery pack 370formed in the housing 310, and may be disposed to avoid the PCB 360.According to an embodiment of the present disclosure, the battery pack370 and the PCB 360 do not overlap each other but may be disposed in aparallel manner. According to an embodiment of the present disclosure,the display module 330 may be fixed to the bracket 320, and the frontwindow 340 may be fixedly attached to the bracket 320 by a first bondingmember 391. According to an embodiment of the present disclosure, therear window 350 may be fixedly attached to the housing 310 by a secondbonding member 392.

According to an embodiment of the present disclosure, the front window340 may include a planar part 3401, and a left bending part 3402 and aright bending part 3403 bent from the planar part 3401 in oppositedirections. According to an embodiment of the present disclosure, thefront window 340 may be located on the electronic device 300 to form afront surface of the electronic device 300 and may display a screendisplayed by the display module 330 using a transparent material andprovide input/output windows for various sensors. According to anembodiment of the present disclosure, although it is illustrated thatthe left and right bending parts 3402 and 3403 have a shape formed in a3D manner, an upper/lower single refraction form or anupper/lower/left/right double refraction form may be applied in additionto the left/right refraction form. According to an embodiment of thepresent disclosure, a touch panel may be further disposed on a rearsurface of the front window 340, and a touch input signal may bereceived from the outside through the touch panel.

According to various embodiments of the present disclosure, the displaymodule 330 also may have a shape (having a corresponding curvature)corresponding to the front window 340. According to an embodiment of thepresent disclosure, the display module 330 may include left and rightbending parts 3302 and 3303 with respect to the planar part 3301.According to an embodiment of the present disclosure, the display module330 may employ a flexible display (UB) module. According to anembodiment of the present disclosure, when the rear surface of the frontwindow 340 has the form of a window of a planar manner (hereinafter, a2D manner or a 2.5D manner), a general Liquid Crystal Display (LCD) oran On-Cell Tsp AMOLED (OCTA) may be applied because the rear surface ofthe front window 340 is planar.

According to various embodiments of the present disclosure, the firstbonding member 391 is a component for fixing the front window 340 to thebracket 320 disposed in the electronic device 300, and may be adouble-sided tape or a liquid adhesive layer such as bond. According toan embodiment of the present disclosure, when a double-sided tape isapplied as the first bonding member 391, a general PolyEthyleneTerephsthalate material may be applied or a functional base may beapplied as an internal base. For example, the front window can beprevented from being damaged by an external impact by reinforcing animpact-resistant property using a base using a foam type orimpact-resistant cloth.

According to various embodiments of the present disclosure, the bracket320 may be disposed in the electronic device 300 and may be used as acomponent for reinforcing the entire strength of the electronic device300. According to an embodiment of the present disclosure, the bracket320 may be formed of at least one metal such as Al, Mg, and STS.According to an embodiment of the present disclosure, the bracket 320may be formed of a high strength plastic containing glass fiber or maybe formed of both a metal and a plastic. According to an embodiment ofthe present disclosure, when a metallic member and a nonmetallic memberare used together, the bracket 320 may be formed in a manner in which ametallic member is insert injection-molded in a nonmetallic member.According to an embodiment of the present disclosure, the bracket 320 islocated on a rear surface of the display module 330, and has a shape(curvature) similar to the shape of the rear surface of the displaymodule 330 to support the display module 330. According to an embodimentof the present disclosure, a resilient member such as sponge or rubber,a bonding layer such as a double-sided tape or a sheet such as a tapemay be further disposed between the bracket 320 and the display module330 to protect the display module 330. According to an embodiment of thepresent disclosure, some sections of the bracket 320 may further includea spot facing and hole area 321 for securing a space for mounting acomponent or a marginal space in consideration of a change of acomponent during use thereof, such as swelling of the battery pack 370.According to an embodiment of the present disclosure, an auxiliary unitfor reinforcing an internal strength by adding a metal or a complexmaterial in the form of a plate in the corresponding hole area 321 maybe included if necessary or for improving thermal characteristics orantenna characteristics. According to an embodiment of the presentdisclosure, the bracket 320 may be coupled to the housing (for example,a rear case) 310 to form a space therein, and at least one electroniccomponent may be disposed in the space. The electronic component mayinclude a Printed Circuit Board (PCB) 360. However, the presentdisclosure is not limited thereto, and may include an antenna unit, anacoustic unit, a power unit, and a sensor unit in addition to a PCB 360.

According to various embodiments of the present disclosure, the batterypack 370 may supply electric power to the electronic device 300.According to an embodiment of the present disclosure, one surface of thebattery pack 370 is adjacent to the display module 330, and an oppositesurface of the battery pack 370 is adjacent to the rear window 350 suchthat the battery pack 370 may cause deformation or damage of acounterpart object while swelling during a charging operation of thebattery pack 370. In order to prevent the problem, a swelling gap isprovided between the battery pack 370 and the counterpart object (forexample, the display module 330 and the rear window 350) to project thecounterpart object. According to an embodiment of the presentdisclosure, the battery pack 370 may be disposed integrally with theelectronic device 300. However, the present disclosure is not limitedthereto, but the battery pack 370 may be detachable when the rear window350 is detached from the electronic device 300.

According to various embodiments of the present disclosure, the housing310 forms an outside (for example, a side surface including a metallicbezel) of the electronic device 300 and may be coupled to the bracket320 to form an internal space. According to an embodiment of the presentdisclosure, the front window 340 is disposed on the front surface of thehousing 310 and the rear window 350 may be disposed on the rear surfaceof the housing 310. According to an embodiment of the presentdisclosure, a gap between the housing 310 and an internal structureformed by the rear window 350 may prevent damage of the rear window 350from a secondary strike by the internal structure when an externalimpact such as a fall of the electronic device 300 occurs.

According to various embodiments of the present disclosure, the wirelesspower transmission/reception member 380 may be disposed on the rearsurface of the housing 310. According to an embodiment of the presentdisclosure, the wireless power transmission/reception member 380 may bedisposed in an area of one surface of the internal embedded component oran inner surface of the housing 310 in the form of a thin film, inparticular, in an area adjacent to the rear window 350, and includes astructure forming a contact point with an internal PCB 360. According toan embodiment of the present disclosure, the wireless powertransmission/reception member 380 may be embedded or attached as acomponent of the battery pack 370 or a part of the housing 310, or maybe attached to the component and the housing 310.

According to various embodiments of the present disclosure, the secondbonding member 392 is a component for fixing the rear window 350 to thehousing 310, and may be applied in the form similar to the first bondingmember 391.

According to various embodiments of the present disclosure, the rearwindow 350 may be applied in the form similar to the front window 340.According to an embodiment of the present disclosure, a front surface ofthe rear window 350 (a surface exposed to the outside) may have acurvature to be inclined towards left and right ends. The rear surfaceof the rear window 350 according to an embodiment of the presentdisclosure is planar to be attached to the housing 310 by the secondbonding member 392.

FIG. 11 is a partially sectional view illustrating a coupled state of anelectronic device 300 including an opaque layer 393 and 394 according tovarious embodiments of the present disclosure.

Referring to FIG. 11, according to an embodiment of the presentdisclosure, opaque layers 393 and 394 may be disposed between the rearsurface of the front window 340 and the display module 330 or betweenthe housing 310 and the rear surface of the rear window 350 to hide aninterior of the electronic device. According to an embodiment of thepresent disclosure, the opaque layer 394 disposed on the front window340 may be applied to an area (for example, a BM area) other than thedisplay area. According to an embodiment of the present disclosure, theopaque layers 393 and 394 may be realized through a process such asprinting, deposition, or painting, and a subsidiary member such as afilm type sheet may be additionally attached. According to an embodimentof the present disclosure, the sheet may have various forms of patternson one surface thereof through a process such as UV molding, printing,or painting. According to an embodiment of the present disclosure, thesheet may be applied to the front window 340 in addition to the rearwindow 350. According to an embodiment of the present disclosure, lighttransmittance can be lowered by directly coloring glass of the window oran aesthetic feeling can be improved by applying various colors.According to an embodiment of the present disclosure, at least oneelectronic component may be further disposed on the rear surface of therear window 350. According to an embodiment of the present disclosure,the electronic component may include an input unit such as a touchpanel, and a charging unit such as a wireless charging module, acommunication module such as a Near Field Communication (NFC) antenna ora display module may be further disposed.

According to another embodiment of the present disclosure, the exteriormember for the electronic device may include a window part 11 includinga polymer film layer 12, and a first UV cured resin layer. The polymerfilm layer 12 may be attached to a lower portion of the window part 110using an Optical Clean Adhesive (OCA) (not illustrated). The first UVcured resin layer 13 may be formed under the polymer film layer 120, anda pattern 13 a may be formed in the first UV cured resin layer 13. Thepattern 13 a may be a decoration pattern, and the decoration pattern isa repeated design pattern including a fine hair line. A deposition layer17 and a printing layer 18 may be further included in the pattern 13 ato realize a color and a metallic feeling.

The pattern 13 may include any one of a decoration pattern, athree-dimensional pattern having a hair line, a molding pattern, and alattice pattern. Here, the pattern 13 may be patterns other than thedisclosed pattern (for example, a repeated pattern).

According to an embodiment of the present disclosure, the pattern 13 amay include any one of a decoration pattern, a three-dimensional patternhaving a hair line, a molding pattern, and a lattice pattern. Here, thepattern 13 a may be patterns other than the disclosed pattern (forexample, a repeated pattern).

According to an embodiment of the present disclosure, FIG. 12illustrates that the pattern 13 a is realized by a lenticular pattern.The pattern may be applied to at least one of the front surface and therear surface of the exterior member of the electronic device. Thelenticular pattern may be applied in a protruding shape in the form of aplurality of repeated stripes, and the direction of the stripes may be awidthwise direction, a lengthwise direction, or other possibledirections of the electronic device. The protruding direction of theprotruding shape of the stripes may be the direction towards theinterior of the electronic device from the exterior member.

According to an embodiment of the present disclosure, FIG. 13Aillustrates an enlarged view of the lenticular pattern shape. The heightof the pattern is about 15 μm, but may be more than or less than 15 μm.The interval of the pattern is about 75 μm, but may be more than or lessthan 75 μm. It is advantageous in manufacturing that the height of thelenticular pattern increases and an interval of the lenticular patternincreases.

According to an embodiment of the present disclosure, FIG. 13Billustrates an enlarged view of the lattice pattern shape. The height ofthe lattice pattern is about 10 μm, but may be more than or less than 10μm. The width of the lattice pattern is about 140 μm, but may be morethan or less than 140 μm.

FIG. 14 illustrates a network environment including an electronic deviceaccording to an embodiment of the present disclosure.

Referring to FIG. 14, an electronic device 101 may include a bus 111, aprocessor 112, a memory 113, an Input/Output (I/O) interface 114, adisplay 115, and a communication interface 116.

The bus 111 may be circuitry that connect the foregoing components andallow communication (e.g., send control messages) between the foregoingcomponents.

The processor 112 may, for example, receive instructions from othercomponents (e.g., the memory 113, the I/O interface 114, the display115, or the communication interface 116), interpret the receivedinstructions and execute computation or data processing according to theinterpreted instructions.

The memory 113 may, for example, store instructions or data that arereceived from, or generated by, other components (e.g., the memory 113,the I/O interface 114, the display 115, or the communication interface116). For example, the memory 113 may include programming modules suchas a kernel 121, a middleware 122, an Application Programming Interface(API) 123 or an application 124. Each of the foregoing programmingmodules may include a combination of at least two of software, firmwareor hardware.

The kernel 121 may control or manage system resources (e.g., the bus111, the processor 112 or the memory 113) that may be used in executingoperations or functions implemented in other programming modules suchas, for example, the middleware 122, the API 123 or the application 124.Also, the kernel 121 may provide an interface for allowing themiddleware 122, the API 123 or the application 124 to access individualcomponents of the electronic device 101.

The middleware 122 may be a medium through which the kernel 121 maycommunicate with the API 123 or the application 124 to send and receivedata. Also, the middleware 122 may control (e.g., scheduling or loadbalancing) work requests by one or more applications 124 by, forexample, assigning priorities for using system resources (the bus 111,the processor 112 or the memory 113) of the electronic device 101 to theone or more applications 124.

The API 123 is an interface that may control functions that theapplication 124 may provide at the kernel 121 or the middleware 122. Forexample, the API 123 may include at least an interface or function(e.g., command) for file control, window control, video processing orcharacter control.

According to various embodiments, the application 124 may include, forexample, an SMS/MMS application, an email application, a calendarapplication, an alarm application, a health care application (e.g.,exercise amount or blood sugar level measuring application) or anenvironmental information application (e.g., an application that mayprovide atmospheric pressure, humidity or temperature information). Inaddition to or alternatively, the application 124 may be an applicationthat is associated with information exchange between the electronicdevice 101 and a peer electronic device (e.g., the electronic device118). The application that is associated with the information exchangemay include, for example, a notification relay application that mayprovide the peer electronic device with certain type of information, ora device management application that may manage the peer electronicdevice.

For example, the notification relay application may include afunctionality that provides notification generated by other applicationsat the electronic device 101 (e.g., SMS/MMS application, emailapplication, health care application or environmental informationapplication) to a peer electronic device (e.g., the electronic device118). In addition to or alternatively, the notification relayapplication may provide, for example, receive notification from a peerelectronic device (e.g., the electronic device 118) and provide thenotification to a user. The device management application may manage,for example, enabling or disabling of functions associated with at leasta portion of a peer electronic device (the peer electronic deviceitself, or one or more components of the peer electronic device) incommunication with the electronic device 101, controlling of brightness(or resolution) of a display of the peer electronic device, orapplication operated at, or service (e.g., voice call service ormessaging service) provided by, the peer electronic device.

According to various embodiments, the application 124 may include, forexample, one or more applications that are determined according to aproperty (e.g., type of electronic device) of the peer electronic device(e.g., the electronic device 118). For example, if the peer electronicdevice is an mp3 player, the application 124 may include one or moreapplications related to music playback. In another example, if the peerelectronic device is a mobile medical device, the application 124 may behealth care-related applications. According to an embodiment, theapplication 124 may include at least one of an application that ispreloaded at the electronic device 101 or an application that isreceived from a peer electronic device (e.g., the electronic device 118or the server 119).

The I/O interface 114, for example, may receive an instruction or datafrom a user and send, via the bus 111, the instruction or data to theprocessor 112, the memory 113, or the communication interface 116. Forexample, the I/O interface 114 may provide data associated with userinput received via a touch screen to the processor 112. Also, the I/Ointerface 114 may, for example, output instructions or data received viathe bus 111 from the processor 112, the memory 113, or the communicationinterface 116, via an I/O device (e.g., a speaker or a display). Forexample, the I/O interface 114 may output voice data processed using theprocessor 112, via a speaker.

The display 115 may display various types of information (e.g.,multimedia or text data) to the user.

The communication interface 116 may provide communication between theelectronic device 101 and one or more peer electronic devices (e.g., theelectronic device 118 or the server 119). For example, the communicationinterface 116 may communicate with the peer electronic device byestablishing a connection with the network 117 using wireless or wiredcommunication. The wireless communication may be at least one of, forexample, Wi-Fi, Bluetooth, Near Field Communication (NFC), GlobalPositioning System (GPS), or cellular communication (e.g., LTE, LTE-A,CDMA, WDCMA, UMTS, WiBro or GSM). The wired communication may be atleast one of, for example, Universal Serial Bus (USB), High DefinitionMultimedia Interface (HDMI), recommended standard 232 (RS-232) or PlainOld Telephone Service (POTS).

According to various embodiments, the network 117 may be atelecommunications network. The telecommunications network may includeat least one of, for example, a computer network, the Internet, theInternet of Things or a telephone network. According to an embodiment, aprotocol (e.g., transport layer protocol, data link layer protocol orphysical layer protocol) for communicating between the electronic device101 and a peer electronic device may be supported by, for example, atleast one of the application 124, the application programming interface123, the middleware 122, the kernel 121 or the communication interface116.

FIG. 15 illustrates a block diagram of an electronic device according toan embodiment of the present disclosure.

Referring to FIG. 15, an electronic device 200′ may be, for example, apart or all of the electronic device 101. Referring to FIG. 15, theelectronic device 200′ may include one or more Application Processors(AP) 210′, a communication module 220′, a Subscriber IdentificationModule (SIM) card 224′, a memory 230′, a sensor module 240′, an inputmodule 250′, a display module 260′, an interface 270′, an audio module280″, a camera module 291′, a power management module 295′, a battery296′, an indicator 297′ or a motor 298′.

The AP 210′ may control one or more hardware or software components thatare connected to the AP 210′, or perform processing or computation ofdata (including multimedia data). The AP 210′ may be implemented, forexample, as a System-on-Chip (SoC). The AP 210′ may further include aGraphics Processing Unit (GPU; not shown).

The communication module 220′ (e.g., the communication interface 116)may transmit and receive data in communications between the electronicdevice 200′ and other electronic devices (e.g., the electronic device118 or the server 119). The communication module 220′ may include, forexample, one or more of a cellular module 221′, a Wi-Fi module 222′, aBluetooth module 225′, a GPS module 227′, a Near-Field Communication(NFC) module 228′, or a Radio Frequency (RF) module 229′.

The cellular module 221′ may provide services such as, for example,voice call, video call, Short Messaging Service (SMS) or internet, via acommunication network (e.g., LTE, LTE-A, CDMA, WCDMA, UMTS, WiBro orGSM). The cellular module 221′ may, for example, also differentiate andauthorize electronic devices within a communication network, using asubscriber identification module (SIM) card (e.g., the SIM card 224′).According to an embodiment, the cellular module 221′ may perform atleast a part of the functionalities of the AP 210′. For example, thecellular module 221′ may perform at least a part of multimedia controlfunctionality.

According to an embodiment, the cellular module 221′ may include aCommunication Processor (CP). The cellular module 221′ may, for example,be implemented as SoC. Although FIG. 15 shows components such as thecellular module 221′ (e.g., CP), the memory 230′ or the power managementmodule 295′ as components that are separate from the AP 210′, accordingto the present disclosure, the AP 210′ may include, or be integratedwith, one or more of the foregoing components (e.g., the cellular module221′).

According to an embodiment, the AP 210′ or the cellular module 221′(e.g., a CP) may process instructions or data received from at least oneof a non-volatile memory or other components by loading in a volatilememory. Also, the AP 210′ or the cellular module 221′ may store at thenon-volatile memory at least one of data that is received from at leastone of other components or data that is generated by at least one of theother components.

Each of the Wi-Fi module 222′, the Bluetooth module 225′, the GPS module227′ or the NFC module 228′ may, for example, include one or moreprocessors that may process data received or transmitted by therespective modules. Although FIG. 2 shows the cellular module 221′, theWi-Fi module 223′, the Bluetooth module 225′, the GPS module 227′ andthe NFC module 228′ as separate blocks, according to an embodiment, anycombination (e.g., two or more) of the cellular module 221′, the Wi-Fimodule 223′, the Bluetooth module 225′, the GPS module 227′ or the NFCmodule 228′ may be included in an Integrated Chip (IC) or an IC package.For example, at least some of the processors corresponding to therespective cellular module 221′, the Wi-Fi module 223′, the Bluetoothmodule 225′, the GPS module 227′ or the NFC module 228′ may beimplemented as a single SoC. For example, a CP corresponding to thecellular module 221′ and a Wi-Fi processor corresponding to the Wi-Fimodule 223′ may be implemented as a single SoC.

The RF module 229′ may, for example, transmit and receive RF signals.Although not shown, the RF module 229′ may include a transceiver, aPower Amp Module (PAM), a frequency filter or a Low Noise Amplifier(LNA). Also, the RF module 229′ may include one or more components fortransmitting and receiving Electro-Magnetic (EM) waves in free spacesuch as, for example, conductors or conductive wires. Although FIG. 15shows that the cellular module 221′, the Wi-Fi module 223′, theBluetooth module 225′, the GPS module 227′ and the NFC module 228′ aresharing one RF module 229′, according to an embodiment, at least one ofthe cellular module 221′, the Wi-Fi module 223′, the Bluetooth module225′, the GPS module 227′ or the NFC module 228′ may transmit andreceive RF signals via a separate RF module.

The SIM card 224′ may be a card implementing a SIM, and may beconfigured to be inserted into a slot disposed at a specified locationof the electronic device. The SIM card 224′ may include a uniqueidentifier (e.g., Integrated Circuit Card Identifier (ICCID)) orsubscriber information (e.g., International Mobile Subscriber Identity(IMSI)).

The memory 230′ may include an internal memory 232′ or a peer memory224′. The internal memory 232′ may be, for example, at least one ofvolatile memory (e.g., Dynamic RAM (DRAM), Static RAM (SRAM) orSynchronous Dynamic RAM (SDRAM)) or non-volatile memory (e.g., One TimeProgrammable ROM (OTPROM), Programmable ROM (PROM), Erasable andProgrammable ROM (EPROM), Electrically Erasable and Programmable ROM(EEPROM), mask ROM, flash ROM, NAND flash memory or NOR flash memory).

According to an embodiment, the internal memory 232′ may be a SolidState Drive (SSD). The peer memory 234′ may be, for example, a flashdrive (e.g., a Compact Flash (CF) drive, a Secure Digital (SD), a microSecure Digital (micro-SD), a mini Secure Digital (mini-SD), an extremeDigital (xD) or a Memory Stick). The peer memory 234′ may be operativelycoupled to the electronic device 200′ via various interfaces. Accordingto an embodiment, the electronic device 200′ may include recordingdevices (or recording media) such as, for example, Hard Disk Drives(HDD).

The sensor module 240′ may measure physical/environmental properties ordetect operational states associated with the electronic device 200′,and convert the measured or detected information into signals such as,for example, electric signals or electromagnetic signals. The sensormodule 240′ may include at least one of, for example, a gesture sensor240′A, a gyro sensor 240′B, an atmospheric pressure sensor 240′C, amagnetic sensor 240′D, an accelerometer 240′E, a grip sensor 240′F, aproximity sensor 240′G, an RGB sensor 240′H, a biometric sensor 240′I, atemperature/humidity sensor 240′J, a luminosity sensor 240′K or an UltraViolet (UV) sensor 240′M. The sensor module 240′ may detect theoperation state of the electronic device or measure physical propertiesand convert the detected or measured information into electricalsignals. Additionally or alternatively, the sensor module 240′ may alsoinclude, for example, electrical-nose sensor (not shown),electromyography (EMG) sensor (not shown), electroencephalogram (EEG)sensor (not shown), infrared (IR) sensor (not shown), eye-scanningsensor (e.g., iris sensor; not shown) or fingerprint sensor. Sensormodule 240′ may also include control circuitry for controlling one ormore sensors included therein.

The input module 250′ may include a touch panel 252′, a (digital) pensensor 254′, a key 256′ or an ultrasonic input device 258′. The touchpanel 252′ may detect touch input using, for example, capacitive,resistive, infrared or ultrasonic methods. The touch panel 252′ may alsoinclude a touch panel controller (not shown). A capacitive-type touchpanel may, for example, detect proximity inputs (e.g. hovering input) inaddition to, or alternative to, physical touch inputs. The touch panel252′ may also include a tactile layer. Haptic feedback may be providedto the user using the tactile layer.

The (digital) pen sensor 254′ may be implemented, for example, usingmethods identical to or similar to receiving a touch input from a user,or using a separate detection sheet (e.g., a digitizer). The key 256′may be, for example, a keypad or a touch key. The ultrasonic inputdevice 258′ may be a device configured to identify data by detecting,using a microphone (e.g., the microphone 288′), ultrasonic signalsgenerated by a device capable of generating the ultrasonic signal. Theultrasonic input device 258′ may detect data wirelessly. According to anembodiment, the electronic device 200′ may receive user input from apeer device (e.g., a network, computer or server) connected toelectronic device 200′ using the communication module 220′.

The display module 260′ (e.g., the display 115) may include a panel262′, a hologram device 264′ or a projector 266′. The panel 262′ may be,for example, a Liquid-Crystal Display (LCD) or an Active-Matrix OrganicLight-Emitting Diode (AM-OLED) display. The panel 262′ may be configuredto be, for example, flexible, transparent or wearable. The panel 262′and the touch panel 252′ may be implemented as a single module. Thehologram device 264′ may utilize the interference of light waves toprovide a three-dimensional image in empty space. The projector 266′ mayprovide image by projecting light on a surface (e.g., a wall or ascreen). The surface may, for example, be positioned internal or peer tothe electronic device 200′. According to an embodiment, the displaymodule 260′ may also include a control circuitry for controlling thepanel 262′, the hologram device 264′ or the projector 266′.

The interface 270′ may include, for example, one or more interfaces fora High-Definition Multimedia Interface (HDMI) 272′, a Universal SerialBus (USB) 274′, a projector 276 or a D-subminiature (D-sub) 278′.Additionally or alternatively, the interface 270′ may include, forexample, one or more interfaces for Secure Digital (SD)/MultiMedia Card(MMC) (not shown) or Infrared Data Association (IrDA) (not shown).

The audio codec 280″ may encode/decode a voice into an electricalsignal, and vice versa. The audio codec 280″ may, for example,encode/decode voice information that is input into, or output from, thespeaker 282′, the receiver 284′, the earphone 286′ or the microphone288′.

The camera module 291′ may capture still images or video. According toan embodiment, the camera module 291′ may include one or more imagesensors (e.g., front sensor module or rear sensor module; not shown), anImage Signal Processor (ISP, not shown), or a flash Light-Emitting Diode(flash LED, not shown).

The power management module 295′ may manage electrical power of theelectronic device 200′. Although not shown, the power management module295′ may include, for example, a Power Management Integrated Circuit(PMIC), a charger Integrated Circuit (charger IC) or a battery fuelgauge.

The PMIC, for example, may be disposed in an integrated circuit or anSoC semiconductor. The charging method for the electronic device 200′may include wired or wireless charging. The charger IC may charge abattery, or prevent excessive voltage or excessive current from acharger from entering the electronic device 200′. According to anembodiment, the charger IC may include at least one of a wired chargerIC or a wireless charger IC. The wireless charger IC may be, forexample, a magnetic resonance type, a magnetic induction type or anelectromagnetic wave type, and may include circuits such as, forexample, a coil loop, a resonance circuit or a rectifier.

The battery gauge may measure, for example, charge level, voltage whilecharging, or temperature of the battery 296′. The battery 296′ maysupply power to, for example, the electronic device 200′. The battery296′ may be, for example, a rechargeable battery.

The indicator 297′ may indicate one or more states (e.g., boot status,message status or charge status) of the electronic device 200′ or aportion thereof (e.g., the AP 210′). The motor 298′ may convertelectrical signal into mechanical vibration. The MCU 299 ‘may controlthe sensor module 240’.

Although not shown, the electronic device 200′ may include one or moredevices for supporting mobile television (mobile TV, e.g., a GraphicsProcessing Unit (GPU)). The devices for supporting mobile TV supportprocessing of media data compliant with, for example, Digital MultimediaBroadcasting (DMB), Digital Video Broadcasting (DVB) or media flow.

FIG. 16 illustrates a block diagram of a programming module according toan embodiment of the present disclosure.

Referring to FIG. 16, a programming module 300′ may be included (forexample, stored) in the electronic device 100 (for example, in thememory 113) illustrated in FIG. 14. At least a part of the programmingmodule 300′ may be implemented in software, firmware, hardware, or in acombination of them. The programming module 300′ may be implemented inhardware (for example, the electronic device 200′) and may include anOperating System (OS) that controls resources related to an electronicdevice (for example, the electronic device 100) or various applicationsexecuted on the OS (for example, applications 370′). For example, the OSmay be Android, iOS, Windows, Symbian, Tizen, Bada, or the like.Referring to FIG. 16, the programming module 300′ may include a kernel310′, middleware 330′, an Application Programming Interface (API) 360′,or the applications 370′.

The kernel 310′ (for example, the kernel 121) may include a systemresource manager 311′ or a device driver 312′. The system resourcemanager 311′ may include, for example, a process manager (not shown), amemory manager (not shown), or a file system manager (not shown). Thesystem resource manager 311′ may control, allocate, or deallocate systemresources. The device driver 312′ may include, for example, a displaydriver (not shown), a camera driver (not shown), a Bluetooth driver (notshown), a shared memory driver (not shown), a USB driver (not shown), akeypad driver (not shown), a Wi-Fi driver (not shown), or an audiodriver (not shown). In an embodiment of the present disclosure, thedevice driver 312′ may include an Inter-Process Communication (IPC)driver (not shown).

The middleware 330′ may include a plurality of modules that have alreadybeen implemented to provide functions commonly used for the applications370′. The middleware 330′ may provide functions through the API 360′ sothat the applications 370′ may efficiently use limited system resourcesavailable within the electronic device. For example, as illustrated inFIG. 16, the middleware 330′ (for example, the middleware 122) mayinclude at least one of a runtime library 335′, an application manager341′, a window manager 342′, a multimedia manager 343′, a resourcemanager 344′, a power manager 345′, a database manager 346′, a packagemanager 347′, a connectivity manager 348′, a notification manager 349′,a location manager 350′, a graphic manager 351′, or a security manager352′.

The runtime library 335′ may include, for example, a library module thata complier uses to add a new function in a programming language duringexecution of an application 370′. In an embodiment of the presentdisclosure, the runtime library 335′ may perform input/output, memorymanagement, a function related to arithmetic function, or the like.

The application manager 341′ may manage, for example, the life cycle ofat least one of the applications 370′. The window manager 342′ maymanage GUI resources used for a screen. The multimedia manager 343′ maydetermine formats used to play back various media files and may encodeor decode a media file using a CODEC suitable for the format of themedia file. The resource manager 344′ may manage resources includingsource code, a memory, or storage space of at least one of theapplications 370′.

The power manager 345′ may manage a battery or a power source byoperating in conjunction with a Basic Input/Output System (BIOS) and mayprovide power information used for an operation. The database manager346′ may manage a database for at least one of the applications 370′ sothat the database may be generated, searched, or modified. The packagemanager 347′ may manage installation or update of an applicationdistributed as a package file.

The connectivity manager 348′ may manage, for example, wirelessconnectivity of Wi-Fi, Bluetooth, or the like. The notification manager349′ may indicate or notify an event such as message arrival, aschedule, a proximity alarm, or the like in a manner that does notbother a user. The location manager 350′ may mange position informationabout the electronic device. The graphic manager 351′ may managegraphical effects to be provided to the user or related user interfaces.The security manager 352′ may provide an overall security function usedfor system security, user authentication, and the like. In an embodimentof the present disclosure, if the electronic device (for example, theelectronic device 100) has a telephony function, the middleware 330′ mayfurther include a telephony manager (not shown) to manage a voice orvideo call function of the electronic device.

A new middleware module may be created and used by combining variousfunctions of the above-described component modules in the middleware330′. The middleware 330′ may provide a customized module for each OStype in order to provide differentiated functions. In addition, themiddleware 330′ may dynamically delete a part of the existing componentsor add a new component. Accordingly, a part of the components may beomitted, another component may be added, or a component may be replacedwith a component with a different name but a similar function in theembodiment of the present disclosure.

The API 360′ (for example, the API 123) is a set of API programmingfunctions, which may be configured differently according to an OS. Forexample, in the case of Android or iOS, one API set may be provided perplatform, whereas in the case of Tizen, two or more API sets may beprovided per platform.

The applications 370′ (for example, the applications 124) may include,for example, a preloaded application or a third party application.

At least a part of the programming module 300′ may be implemented ascommands stored in a computer-readable storage medium. When a command isexecuted by one or more processors (for example, the processor 210′),the one or more processors may execute a function corresponding to thecommand. The computer-readable storage medium may be, for example, thememory 230′. At least a part of the programming module 300′ may beimplemented (for example, executed) by the processor 210′. At least apart of the programming module 300′ may include, for example, a module,a program, a routine, a set of instructions, and/or a process to executeone or more functions.

The names of components of a programming module according to the presentdisclosure (for example, the programming module 300′) may vary accordingto the type of an OS. The programming module of the present disclosuremay include at least one of the afore-described components, may notinclude a part of the components, or may include an additionalcomponent. Operations of the programming module or other componentsaccording to the present disclosure may be performed sequentially, inparallel, repeatedly, or heuristically. Further, a part of theoperations may be omitted or a new operation may be added.

Components of hardware described above according to the presentdisclosure may each include one or more components, and each component'sname may vary according to the type of an electronic device. Thehardware according to the present disclosure may include at least one ofthe above-described components, and some may be omitted or may includeadditional components. Also, some of the components of the hardwareaccording to the present disclosure may be combined into a single entityand perform functions identical or similar to those of the respectivecomponents before their combination.

The term “module” as used herein may include its ordinary meaningincluding, but not limited to, for example, a unit of one, or acombination of two or more, hardware, software or firmware. The term“module” may be used interchangeably with terms such as, for example,unit, logic, logical block, component or circuit. A module may be thesmallest unit for performing one or more functions, or a portionthereof. A module may be implemented mechanically, or electronically.For example, a module according to the present disclosure may include atleast one of a known, or to-be-developed, Application-SpecificIntegrated Circuit (ASIC) chip, Field-Programmable Gate Array (FPGA) orprogrammable logic device that perform certain operations.

A module according to the present disclosure may include one or more ofthe above-described components, may omit a portion thereof, or mayinclude additional components. Operations that are performed by amodule, a programming module or other components according to thepresent disclosure may be processed in a serial, parallel, repetitive orheuristic manner, and some operations may be omitted or additionaloperations may be added.

While the disclosure has been shown and described with reference tocertain exemplary embodiments thereof, it will be understood by thoseskilled in the art that various changes in form and details may be madetherein without departing from the spirit and scope of the invention asdefined by the appended claims and their equivalents.

1-24. (canceled)
 25. A portable communication device comprising: a frontwindow forming at least part of a front surface of the portablecommunication device; a display disposed under the front window to beseen through at least one portion of the front window; a rear caseforming at least part of a rear surface of the portable communicationdevice and including a substantially transparent material; an adhesivelayer disposed in contact with the rear case; a polymer layer attachedto the rear case via the adhesive layer; and a resin layer disposed incontact with the polymer layer and including a repeating protrusionpattern protruding toward the front window, an interval betweensubsequent protruding portions of the repeating protrusion pattern beinggreater than a height of the repeating protruding pattern.
 26. Theportable communication device of claim 25, wherein the front window isat least partially composed of a glass.
 27. The portable communicationdevice of claim 25, wherein the front window includes a planar portion,a first curved portion extended from a first edge of the planar portion,and a second curved portion extended from a second edge of the planarportion opposite to the first edge of the planar portion.
 28. Theportable communication device of claim 25, further comprising one ormore sidewalls surrounding at least portion of a space between the frontwindow and the rear case and at least partially composed of a metallicmaterial.
 29. The portable communication device of claim 28, wherein theone or more sidewalls include a first surface portion and a secondsurface portion facing each other in a first direction and having afirst same height, and a third surface portion and a fourth surfaceportion facing each other in a second direction and having a second sameheight, the second direction being perpendicular to the first direction.30. The portable communication device of claim 29, wherein a height ofat least one end portion of the first surface portion gradually changesfrom the first same height to the second same height.
 31. The portablecommunication device of claim 29, wherein the rear case includes a firstcurved surface bent toward the first surface portion and a second curvedsurface bent toward the second surface portion.
 32. The portablecommunication device of claim 25, wherein the adhesive layer includes anoptically clear adhesive layer.
 33. The portable communication device ofclaim 25, wherein the resin layer includes an ultraviolet resin layer.34. The portable communication device of claim 25, wherein a material ofthe resin layer includes a polymeric material.
 35. The portablecommunication device of claim 25, wherein the protruding portions of therepeating protrusion pattern have a rounded shape in cross-section. 36.The portable communication device of claim 25, wherein a pitch of therepeating protrusion pattern is greater than the height of the repeatingprotruding pattern.
 37. A portable communication device comprising: afront window forming at least part of a front surface of the portablecommunication device; a display disposed under the front window to beseen through at least one portion of the front window; a rear caseforming at least part of a rear surface of the portable communicationdevice; an adhesive layer disposed in contact with the rear case; apolymer layer attached to the rear case via the adhesive layer; and aresin layer disposed in contact with the polymer layer and including arepeating lenticular pattern such that a specified visual effect is tobe seen through at least one portion of the rear case using therepeating lenticular pattern.
 38. The portable communication device ofclaim 37, wherein the specified visual effect includes a specifiedcolor, a specified texture, a specified decoration, a specified design,or any combination thereof.
 39. The portable communication device ofclaim 37, wherein the repeating lenticular pattern is formed to protrudetoward the front window.
 40. The portable communication device of claim37, wherein an interval between subsequent lenticular portions of therepeating lenticular pattern has a distance that is larger than a heightof the repeating lenticular pattern.
 41. The portable communicationdevice of claim 37, further comprising one or more sidewalls including afirst surface portion and a second surface portion facing each other ina first direction and having a first same height, and a third surfaceportion and a fourth surface portion facing each other in a seconddirection and having a second same height, the second direction beingperpendicular to the first direction.
 42. The portable communicationdevice of claim 37, further comprising a deposition layer disposed incontact with the resin layer and including the repeating lenticularpattern protruding toward the front window.
 43. The portablecommunication device of claim 42, further comprising a printing layerdisposed in contact with the deposition layer.
 44. A portablecommunication device comprising: a front window forming at least part ofa front surface of the portable communication device; a display disposedunder the front window to be seen through at least one portion of thefront window; a first layer forming at least part of a rear surface ofthe portable communication device and including a substantiallytransparent material; a second layer disposed in contact with the rearcase; a third layer attached to the first layer via the second layer;and a fourth layer disposed in contact with the third layer andincluding a repeating protrusion pattern protruding toward the frontwindow, an interval between subsequent protruding portions of therepeating protrusion pattern being greater than a height of therepeating protruding pattern.